Photo Electroforming

Details

Materials Include – Nickel (both hard and soft), Polymer, Gold and Copper.
Material Thickness – Can be as thin as 3-4 microns.
Size – Material panels as large as 18” x 24” are processed.
Dimension Tolerances – Generally +/-10 microns or better.
Through Holes as small as 2-3 microns.
Positional Tolerances – Normally +/- 1-2 microns.
Parts can be produced with unique multi-level features
Features & Details – Photo Electroforming uses CAD files to assist in fabrication of application’s design. If a design can be drawn in 2D CAD file, chances are good it can be electroformed.
Applications – Parts and components are produced for many markets, including; Masking, Sieving, Avionics, Filtration, Medical Devices, Electronics, Scientific Controls and much more.


Photo shown is multi-level filter material, containing 40um holes with hex support grid	Cross section of a multi-level embossing die.

Typical profiles:

Overgrown and multi-level	Stepped multi-level

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